AMD’s upcoming 3rd Gen EPYC processors with AMD 3D V-Cache and Instinct MI200 series GPU accelerators are designed to address these needs using leading-edge memory and interconnect technologies that bring significant performance improvements to AMD’s data center products and platforms.

3D V-Cache is essentially a 64MB SRAM cache manufactured on TSMC’s 7nm node that attaches directly on top of each core complex die (CCD) in a Zen 3-based processor, to effectively triple the amount of high speed L3 cache available to the processor cores. The additional cache is bonded directly to the CCD using Through Silicon Vias (TSVs), with no soldered bumps of any kind.

In addition to its 3rd Gen EPYC processors with 3D V-cache, AMD also unveiled its most powerful GPU accelerators to date, the AMD Instinct MI200 series. Unlike consumer-targeted Radeon GPUs that are based on the company’s RDNA 2 GPU architecture, AMD Instinct accelerators leverage CDNA 2, which is designed specifically for high performance scalar and vector processing workloads and incorporate new Matrix Core Engines.