As Moore’s Law has slowed, engineers have faced numerous challenges in their attempts to address the ever-evolving needs of the demanding semiconductor and electronics industries. The historic power, area, and performance benefits that traditionally came by shrinking chips on more advanced fab process nodes have slowed considerably, while complexity has skyrocketed and costs have commensurately increased. That reality was simply unsustainable in the long term and forced engineers to devise creative solutions. It turns out that virtually all of the major players in the space turned to multi-die systems, which have supplanted large monolithic chips for many applications.