Intel Launches Hybrid Processors With 3D Chip Stack Technology To Enable Ultra-Portable PCs

Today, Intel is revealing its initial line-up of market-ready Hybrid Core Processors leveraging these technologies, which the company believes will usher in a new wave of innovative PC form factors, including the world’s first foldable PC. And no, I’m not talking about a standard laptop – think more along the lines of a scaled-up Galaxy Fold with Intel inside.

Intel Lakefield Processor Built On Foveros 3D Chip-Stacking Tech

Intel Lakefield Processor Built On Foveros 3D Chip-Stacking Tech